TS2500

200 mm Fully Automated Probe System For RF Production Test Measurements Key Features: Designed for Wide Variety of RF On-Wafer Production Applications • RF applications up to 67 GHz & 4-port setup • Simutaneously for DC-IV / DC-CV / Pulsed-IV measurements Production Reliability • Designed for 24/7 production reliability Ergonomic Design and Options • Designed with easy single wafer front loading • Large Probe Platen supporting up to 4x RF MicroPositioners or standard 4.5” probe card holder • Dual end-effector and embedded pre-aligner for highest throughput • Available with various chuck options and wide range of accessories • Standard off-axis wafer alignment camera • Optional upper looking chuck camera for probe-to-pad alignment • Dedicated thin wafer handling option